100% Silicone, solventless
One component, moisture-cured
Highly Resistive to mold formation
Excellent primer less adhesion to numerous porous and non-porous substrates
Excellent weather ability in direct sunlight, rain, snow and ozone
Resistant to temperature extremes (-50 °C to +200 °C)
Fast curing
Low modulus, high elasticity
Outstanding resistance to mildew and fungus.
Does not crack or discolor.
Withstands detergents, cleaning agents and chemicals.
Acetoxy curing system.
Conforms to the requirements of VOC content specifications in LEED credit EQc4.1 “Low-emitting products” of SCAQMD rule 1168.

Ensure that surfaces to be sealed are clean, dry and grease free.
The application temperature must be between +5 °C and +40 °C.
In order to reduce the deformations of the joints, their depth must be much less than their width, minimum dimensions are 5x5 mm, for wider joints the depth should be preferably half of the width and it is adjusted by the use of a backup material.
After the application, the sealant must be tooled with light pressure within 5 minutes to spread the material against the joint surfaces and to obtain a professional finish.
Excess uncured sealant may be cleaned with solvent. Cured sealant can be removed barely mechanically.
6 mm. joint depth is recommended for joint widths between 6 mm to 12 mm